Dissemination

Conference Papers


The Effect of Surface Optimization on post-Grinding Yield of 200 mm Wafer Level Packaging Applications, Proc. Electronics Systems-Integration Technology Conference (ESTC 2018), 53 (2018);doi: 10.1109/ESTC.2018.8546457

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Push-Pull Configuration of High Power MOSFETs for Generation of Nanosecond Pulses for Electropermeabilization of Isolated Cancer Stem Cells, 2018 48th European Microwave Conference (EuMC), Madrid, 2018, pp. 866-869; doi: 10.23919/EuMC.2018.8541734

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Electropermeabilization of Isolated Cancer Stem Cells with a Novel and Versatile Nanosecond Pulse Generator, 2018 IEEE International Microwave Biomedical Conference (IMBioC), Philadelphia, PA, 2018, pp. 106-108.; doi: 10.1109/IMBIOC.2018.8428941

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Novel and versatile instrumentation for electro-manipulation of cancer stem cells, BioEM 2018 The Joint Annual Meeting of The Bioelectromagnetics Society and the European BioElectromagnetics Association, June 25-29 2018 Piran, Portoroz, Slovenia

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Permittivity measurements of brain cancer cell solutions: towards the electric characterisation of single cancer stem cells, 1st EMF-Med World Conference on Biomedical Applications of Electromagnetic Fields. Split, Croatia, 10-13 September 2018

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High-Frequency Dielectrophoresis Characterization of Differentiated vs Undifferentiated Medulloblastoma Cells, 2018 EMF-Med 1st World Conference on Biomedical Applications of Electromagnetic Fields (EMF-Med), Split, 2018, pp. 1-2. doi: 10.23919/EMF-MED.2018.8526006

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Tracking cancer cells with microfluidic DEP cytometer implemented on BiCMOS lab-on-chip platform, 2018 IEEE/MTT-S International Microwave Symposium – IMS, Philadelphia, PA, 2018, pp. 104-107.doi: 10.1109/MWSYM.2018.8439466

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Discrimination of Glioblastoma Cancer Stem Cells by measuring their UHF-Dielectrophoresis Crossover Frequency, 2018 IEEE International Microwave Biomedical Conference (IMBioC), Philadelphia, PA, 2018, pp. 130-132: doi: 10.1109/IMBIOC.2018.8428945

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BiCMOS Embedded Microfluidic Technology Based on Wafer Bonding Techniques for Biosensor Applications, MikroSystemTechnik 2017; Congress, Munich, Germany, 2017, pp. 1-4. View Published Article

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BiCMOS Integrated Microfluidic Packaging by Wafer Bonding for Lab-on-Chip Applications,  2017 IEEE 67th Electronic Components and Technology Conference (ECTC), Orlando, FL, 2017, pp. 786-791, doi: 10.1109/ECTC.2017.153

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Oxide Surface Roughness Optimization of BiCMOS BEOL Wafers for 200 mm Wafer Level Microfluidic Packaging Based on Fusion Bonding, 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC), Singapore, 2017, pp. 1-4, doi: 10.1109/EPTC.2017.8277523

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Biological Cell Discrimination Based on Their High Frequency Dielectropheretic Signatures at UHF Frequencies, 2017 IEEE MTT-S International Microwave Symposium (IMS), Honololu, HI, 2017, pp. 533-536, doi: 10.1109/MWSYM.2017.8058618

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